Agilent-Advanced-Design-System-(ADS)-2011-crack

ADS 2011 brings you the following exciting enhancements:

10x speedup in planar 3D electromagnetic simulation
10x speedup in non-linear circuit simulation
Patent pending convolution technology that allows accurate signal integrity simulation with measured S-parameter data of high-speed interconnects
New Simulation Models and Libraries
Further improvement in graphical user interface

The combined benefits of all the above translates to at least a doubling of your design productivity.

10x speedup in planar 3D electromagnetic simulation

The 3D planar EM simulator, Momentum, in ADS 2011 now has at least 10x speed improvement and 6x capacity improvement. This enables you to use electromagnetic simulation as an interactive design tool instead of a sign-off verification tool before hardware prototyping. The high speed of Momentum simulation now allows multiple design explorations to be accomplished easily.

An example of a wireless LAN transceiver simulation where the chip area is minimized by 32% by packing the 11 spiral inductors closer together. This translates to a corresponding 32% reduction in the cost of the 802.11/b transceiver RFIC.

The simulation took just 2.3 minutes with 650MB of RAM as compared to 38 minutes with 1.2GB of RAM in earlier versions of Momentum. This 15x speed improvement allows for interactive placement of the inductors with their proximity effects analyzed very quickly achieving the overall 32% die size reduction.

10x speedup in non-linear circuit simulation

The already powerful harmonic balance simulator in ADS just received additional algorithmic enhancements from Agilent EEsof’s recent acquisition of Xpedion GoldenGate, who has the world’s fastest and highest capacity harmonic balance simulator. Now the harmonic balance simulator in ADS 2009 update 1 can handle bigger circuits and solve them 10x faster. For example, a large RFIC with over 2000 nonlinear elements and over 2000 large signal sources is solved within 250 seconds as compared to 2,485 seconds in the previous versions. The speed and capacity improvements are especially important for fast optimization of large RF-System-In-Package (SIP), MMIC and RFIC to meet higher levels of integration and performance demanded by consumer wireless electronics today.

New Simulation Models and Libraries

The following new models and libraries are now in ADS2011:

PSP and HiSIM transistor models for accurate nano-scale (30nm, 45nm) RFIC simulation
Triquint TOM4 latest III-IV FET model optimized for PHEMT technologies to accurately model highly non-linear behavior
Models for gigabit serial link signal integrity analysis:
HSPICE W-elements
IBIS switches
Verilog AMS
De-embedding element for easy removal of test fixture effects
Impulse response model writer

CODE-V10.2-CRACK

CODE V has been at the forefront of optical design and analysis software innovations, with continual improvements to keep pace with optical industry demands. It is the preferred tool of numerous companies, government agencies, research labs, and universities worldwide. CODE V inspires this loyalty because it reliably produces better optical designs in less time – designs that are often cheaper to fabricate than those produced with other software. With a customizable Windows-based user interface, extensive help features, and excellent technical support to back it up, CODE V is also easy to learn and use.
CODE V Enables Faster Time to Market

CODE V’s flexible user interface, faster algorithms, intelligent defaults, and features to support the manufacturing process all help you develop and assemble the best design faster.

User-friendly interface with customizable data display and navigation features that allow you to adapt the workspace to your workflow and reduce design steps.
Integrated command line enables you to expedite design steps by freely mixing commands and mouse operations.
A fully functional macro capability that provides a powerful tool for enabling complex analyses to be run with an easy-to-use script.
COM interface for automating tasks and leveraging other COM-enabled applications to achieve an integrated, multi-application engineering environment.
New lens wizard to jump start model creation.
Supplied example systems and patent lens search.
Off-the-shelf components.
Built-in prisms models.
Black-box lens modules.
Built-in glass catalogs, including IR/UV materials.
User-programmable features support for surface shape, surface properties, and others.
The fastest design optimization capability in the industry.
Tolerancing and fabrication support features that solve production problems before your design reaches manufacturing.

Mastercam-X5- MU1-crack

Mastercam X5 MU1 is Released
View the "What's New in Mastercam X5" PDF file
View Mastercam archive videos
Detailed list of new additions since the release of Mastercam X


This maintenance update is available at no charge to all current Mastercam maintenance customers, and can be downloaded here.

The updates and new tools available in Mastercam X5 MU1 include:

Mill:

Enhanced collision checking and containment options for 3D HST toolpaths.
Improved Curve 5-axis and Swarf 5-axis cutting, allowing overlap.
Faster Mill tree-style dialog performance.

Router:

Drag and drop parts from one sheet to another during geometry or toolpath nesting.
Output block drilling parameters for easy use on setup sheets and with certain point-to-point routers.

Wire:

Enhanced 4-axis Direct wirepath accommodates a new suite of geometry and outputs even smoother motion.
Improved functionality give you even more precision tab control.

CAD Tools:

Updated file translators for ACIS, CATIA, SolidWorks, Solid Edge, Unigraphics and Rhino.
Easier surface curve selection and solid layout functions.


With the release of Mastercam X5 MU1, we're also introducing Mastercam Port Expert, a new purchasable add-on designed for the head porting industry. This powerful tool can be added on to Mastercam Mill Level 3 or Router Pro, and delivers:

Intelligent, specialized programming that machines as far as possible into the port with 3-axis toolpaths before switching smoothly to 5-axis motion.
Advanced collision detection to help ensure high-quality cuts.
Flexible machining definition and constraints, allowing automatic or manual choices.

ESI PAM-Stamp 2G 2011

Version: 2011.0

OS supported: Windows 32-bit, Windows 64-bit

Languages supported: English only
PAM-STAMP 2G is a complete, integrated, scalable and streamlined stamping solution. It covers the entire tooling process from quotation and die design through formability and try-out validation, including springback prediction and correction. It provides solutions-oriented tools for Automotive, Aerospace, and General stamping processes.

PAM-STAMP 2G allows users to make decisions online, bringing together the design engineer, the material provider, the die designer and the try-out press shop from an early stage of the design right through to production. This web-enabled technology allows images, annotation, text and 3D, models to be shared, thus supporting a truly collaborative engineering environment.